AI

The company, which describes itself as the builder of “the world’s fastest AI infrastructure,

The founders knew that GPUs were not the optimal semiconductors for high-level processes.
However, they had to design unique cooling methods to prevent a "massive" semiconductor from burning 
when drawing power, unique software to route around usual microscopic manufacturing defects, 
and they had to invent a machine that could drill 40 screws into the wafer simultaneously without it cracking.

The company had difficulty solving the problem of integrated circuit packaging:
adhering the silicon to a motherboard, receiving power, and dealing with heating and cooling and the pipes 
to deliver and return data. It was burning through $8 million per month and spent $200 million trying to solve the problem. 
In July 2019, after exhaustive trial and error, the company finally produced a product that worked.

In August 2019, Cerebras announced WSE-1, its first-generation Wafer-Scale Engine (WSE) semiconductors and its CS-1 supercomputing system.
The CS-1 is a 19-inch rack-mounted appliance and includes a single WSE primary processor with 400,000 processing cores, 
1.2 trillion transistors (twelve 100-gigabit ethernet connections), and 18 gigabytes of memory.

CHIP
https://www.cerebras.ai/chip

EN
https://en.wikipedia.org/wiki/Cerebras_Systems